Career Opportunities

Success Starts Here

As a leading global supplier of wafer fabrication equipment and services to the semiconductor industry, Lam Research develops innovative solutions that help our customers build smaller, faster, and more power-efficient devices.

We are a company comprised of people who work hard, deliver outstanding results and maintain a sense of humor during even the most challenging times. Our success results from our employees' diverse technical and business expertise, which fuels close collaboration and ongoing innovation. We know that our dynamic, global team of exceptional employees is essential to our continued growth.

Join the Lam Research team, where you can play a vital role in the future of electronics and write your own success story.

Supplier Engineer, Packaging

Date: Apr 1, 2021

Location: Bayan Lepas, Penang, MY, 11900

Req ID: 155931

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Job Responsibilities

Role Description
You will partner with product engineering, logistics, supply chain, manufacturing and sales operations teams to deliver packaging solutions that optimize customer and company requirements for product protection, material handling, transportation, cost, installation cycle time and foreign trade compliance.
This position supports new product development and sustaining engineering for finished goods and spares materials, as well as supplier packaging for material inbound to manufacturing.  You will have domain expertise in packaging and crating design, package testing, cleanroom packaging, transportation and material handling for large electromechanical assemblies and small parts.

Duties:
1. Directly develop or manage the outsourced development of packaging and crating designs using standardized processes (design review, engineering change creation and approval, first article
2. Participate in product design reviews to influence product design as it relates to design for logistics.  The packaging engineer is the logistics voice in the product design process.
3. Define, develop and maintain packaging and labeling specifications and best-known-methods (BKMs)
4. Drive the development of supplier capability in packaging design and manufacturing through existing supplier assessment, design reviews, root cause and corrective action analysis, and CIP roadmap definition and execution.
5. Drive compliance with SEMI and other regulatory requirements (e.g. customs, dangerous goods, sustainability) as well as industry standards such as ISTA and ASTM.
6. Drive product and package testing utilizing Lam and/or industry standard testing protocols (ISTA, ASTM) to validate packaging designs.
7. Develop packaging and crating strategies that minimize total supply chain costs (material, labor, transportation, handling, storage, pack/unpack cycle times).

Other Job Responsibilities

Minimum Qualifications

Skills and Experience

1. Recognized as an expert in distribution packaging and crating with expertise in packaging design, package testing/qualification, and packaging regulatory issues.
2. In depth understanding of logistics constraints as they impact packaging design, with focus on the transportation and materials handling environments.  Design for Logistics.  Candidates abilities/knowledge will be assessed during interview process.
3. Demonstrated ability to solve unique and complex packaging problems that addresses product protection requirements for distribution, handing, and storage while addressing cost, quality, on-time delivery, and regulatory issues.
4. In depth knowledge of standardized package development processes (Define Distribution Environment, Determine Product Fragility, Product Improvement Feedback, Packaging Material testing/evaluation, Packaging Design, Package Testing/Validation). Use and evaluation of computer simulation modeling for fragility analysis and packaging analysis/validation is preferred.
5. Ability to collaborate and take a leadership role as needed in cross-functional teams as it pertains to packaging and logistics issues.
6. Knowledge and demonstrated use of problem-solving techniques (5 Why Analysis, DMAIC, fishbone) and translate findings into an executable plan.
7. Good data analysis skills and experience extracting information from data
8. Know when and how to communicate- email, presentation, face to face, collaboration tools- to maintain alignment between team members, project executives and project stakeholders in a dynamic, geographically distributed and culturally diverse organization
9. Escalate issues while maintaining positive relationships with team members and other organizations
10. Ability to influence peers, internal customers and executives to gain acceptance of program solutions
11. Knowledgeable with MS Office, PLM, 3D CAD applications, like NX and Creo.
12. CPP certification desired
Education:  Bachelor’s in Packaging or Mechanical Engineering with 7+ years of packaging development experience.
Location: Penang, MY
Travel: 5-10% domestic and international travel expected

 

Preferred Qualifications

Our Commitment

 

Our work is everywhere you look – even if you can’t actually see it. Lam Research goes deeper than software or chips to the heart of the process that enables chip creation. So if you want to help power the components that empower everything, join us.

 

All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, sexual orientation, gender identity, national origin, protected veteran status, or on the basis of disability.

We Look Forward to Your Application

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