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Success Starts Here

As a leading global supplier of wafer fabrication equipment and services to the semiconductor industry, Lam Research develops innovative solutions that help our customers build smaller, faster, and more power-efficient devices.

This success is the result of our employees' diverse technical and business expertise, which fuels close collaboration and ongoing innovation.

Join the Lam Research team, where you can write your own success story. Come help us solve our customers' toughest problems and be part of a company that plays a vital role in the future of electronics.

Lam Research - a company where successful people want to work.

Mechanical Technical Lead Engineer, Sr.

Date: Nov 14, 2018

Location: Bangalore, IN

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Educational Qualification: B.E/B.Tech/M.E/M.Tech (Mechanical/Production/Manufacturing)

Years of experience: Minimum 6 years of relevant experience

           Primary Responsibilities:

  • Designs and analyzes mechanical systems, sub-systems, equipment and packaging.
  • Conducts feasibility studies and testing on new and modified designs.
  • May direct support personnel in the preparation of detailed design, design testing and prototype fabrication/reviews.
  • Provides design information to drafting support for packaging design and documentation.
  • Responsible for performing professional mechanical engineering design and calculations.
  • Responsible for performing research, design, development, modification, and evaluation in support of the company's semiconductor capital equipment and systems.
  • Determine design approaches, participate in C&F studies, assess technical risks and develop qualification test methods to validate design changes to the product and sub-systems.

    Mandatory skills required

  • Hands on experience to take design from concepts thru detailed drawing, parts procurement, DFM interaction with suppliers, assembly, test, build verification, filed/customer qualification with deeper understanding of issues faced, lessons learned and closure.
  • Optimize design to address Reliability, Cost, Manufacturing and Performance issues
  • Knowledge of DFx process (Design for Manufacturability, Cost, Assembly and Serviceability)
  • Ability to work well in a team, in a fast paced environment with aggressive deadlines and multiple priorities while remaining a team player.
  • Exposure to CAD, NX, drawing, GD&T, Tolerance Stack up analysis

Desirable Skill:

  • Excellent verbal and written communication skills; ability to present design concepts to peers and management in a professional and effective way
  • Critical thinker with proven ability to create solutions for complex engineering problems with an ability to learn new skills quickly with minimal guidance.
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  • Ability to perform simple and medium complex stress analysis using software like NX Nastran, Ansys to verify the design
  • Knowledge in Engineering Change Management Process, SAP, PLM
  • Experience in Value Engineering, should costing, cost reduction would be an advantage
  • Exposure to obsolescence management in product engineering – understanding of how to handle an Obscelence part / sub-assembly in a mature product and how to qualify a replacement part.
  • Knowledge and exposure to ANSI, ASME, SAE, ISO, SEMI standards applicable to semiconductor industry.
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