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As a leading global supplier of wafer fabrication equipment and services to the semiconductor industry, Lam Research develops innovative solutions that help our customers build smaller, faster, and more power-efficient devices.

This success is the result of our employees' diverse technical and business expertise, which fuels close collaboration and ongoing innovation.

Join the Lam Research team, where you can write your own success story. Come help us solve our customers' toughest problems and be part of a company that plays a vital role in the future of electronics.

Lam Research - a company where successful people want to work.

Senior Manager -Critical Subsystems-Electrostatic Chucks and Pedestals/Susceptors

Date: Sep 29, 2018

Location: Tualatin, OR, US, 97062

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Lam Research - where successful people want to work:

 

Imagine working on the front lines of innovation! As one of the semiconductor industry’s leading suppliers of wafer fabrication equipment and services, our technology depends on finding and hiring the best and the brightest employees. We know that our dynamic, global team of exceptional employees is essential to our continued growth. 

 

We are a company comprised of people who work hard, deliver outstanding results and maintain a sense of humor during even the most challenging times. This is truly a rare opportunity.  Lam Research is a market leader where our core values are not just words on the back of your badge. Given the criticality of this role to Lam Research’s success, this philosophy starts with you.   

 

Designs and analyzes mechanical systems, equipment and packaging. Conducts feasibility studies and testing on new and modified designs. Directs support personnel in the preparation of detailed design, design testing and prototype fabrication. Provides design information to drafting for packaging documentation.

 

Role- Support of high temperature Johnson-Rahbek electrostatic chucks and ceramic pedestal development through problem solving across a wide range of engineering disciplines. Role includes working with RF engineering to characterize and set electrical specifications including volume resistivity, loss tangent and dielectric constant for ceramics. Also, it includes working with Ceramics suppliers directly and through SMT to ensure they understand and meet our specifications.

 

Job includes developing new Ceramics suppliers and existing supplier capability for pedestal applications needing backside gas delivery and/or edge purge.  This will require developing tests to qualify diffusion bonding or other bonding technology. Position will rely heavily on expertise in ceramic materials, ceramic to metal joining and ceramic to ceramic bonding. Role will require support of thermal characterization or modeling in support of ceramic pedestal and ESC development.

 

Position includes responsibility for characterization of electrostatic chuck clamping force reliability and overall life. Will entail setting up test stands and system level tests for accelerated clamping force reliability simulating 5 years production at a customer. Tests need to cover Fluorine cleans, erosion of MCA height and surface contamination that could affect clamping performance.  Mitigations need to be developed and qualified for all problems uncovered during life testing to ensure maximum life and predicable field performance.

 

Disciplines:

  • Applied physics
  • Multi-disciplinary, multi-domain analysis
  • First principles analysis
  • Transient analysis
  • Electrodynamics

 

Qualifications:

  • Minimum of 12 years of related experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 6 years+ experience
  • Direct experience in high temperature electrostatic chuck design/ development
  • Experience with ceramic pedestals
  • Experience on plasma deposition systems used for semiconductor wafer processing
  • Experience taking process requirements (power, temperature & wafer) and developing engineering specifications
  • Experience developing & executing performance & test plans to qualify wafer process results
  • Experience evaluating results tied to RF delivery/ uniformity, temperature uniformity/ stability and process chemistry

 

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